标准类别

适用领域

AEC-Q100

集成电路IC

AEC-Q101

分立器件

AEC-Q102

离散光电LED

AEC-Q103

传感器

AEC-Q104

多芯片组件

AEC-Q200

被动器件

标准编号

标准名

中文含义

AEC-Q100 Rev-H

Failure Mechanism Based Stress Test Qualification For Integrated Circuits(base document

基于集成电路应力测试认证的失效机理

AEC-Q100-001

Wire Bond Shear Test

邦线切应力测试

AEC-Q100-002

Human Body Model (HBM) Electrostatic Discharge Test

人体模式静电放电测试

AEC-Q100-003

Machine Model (MM) Electrostatic Discharge Test

机械模式静电放电测试

AEC-Q100-004

IC Latch-Up Test

集成电路闩锁效应测试

AEC-Q100-005

Non-Volatile Memory Program/Erase Endurance, Data Retention, and Operational Life Test

非易失性存储程序/擦除耐久性、数据保持及工作寿命的测试

AEC-Q100-006

Electro-Thermally Induced Parasitic Gate Leakage Test (GL)

热电效应引起的寄生门极漏电流测试

AEC-Q100-007

Fault Simulation and Test Grading

故障仿真和测试等级

AEC-Q100-008

Early Life Failure Rate (ELFR)

早期寿命失效率

AEC-Q100-009

Electrical Distribution Assessment

电分配的评估

AEC-Q100-010

Solder Ball Shear Test

锡球剪切测试

AEC-Q100-011

Charged Device Model (CDM) Electrostatic Discharge Test

带电器件模式的静电放电测试

AEC-Q100-012

Short Circuit Reliability Characterization of Smart Power Devices for 12V Systems

12V 系统灵敏功率设备的短路可靠性描述

测试序列A

环境压力加速测试，Accelerated Environment Stress

测试序列B

使用寿命模拟测试，Accelerated Lifetime Simulation

测试序列C

封装组装整合测试，Package Assembly Integrity

测试序列D

芯片晶圆可靠度测试，Die Fabrication Reliability

测试序列E

电气特性确认测试，Electrical Verification

测试序列F

瑕疵筛选监控测试，Defect Screening

测试序列G

封装凹陷整合测试，Cavity Package Integrity

TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTS

#

STRESS

ABV

SAMPLE SIZE / LOT

A1

Preconditioning

PC

77

A2

Temperature Humidity-Bias or Biased HAST

THB or HAST

77

A3

Autoclave or Unbiased HAST or Temperature Humidity (without Bias)

AC or UHSTor TH

77

A4

Temperature Cycling

TC

77

A5

Power Temperature Cycling

PTC

45

A6

High Temperature Storage Life

HTSL

45

TEST GROUP B – ACCELERATED LIFET

#

STRESS

ABV

SAMPLE SIZE / LOT

B1

High Temperature Operating Life

HTOL

77

B2

Early Life Failure Rate

ELFR

800

B3

NVM Endurance, Data Retention, and Operational Life

EDR

77

TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTS

#

STRESS

ABV

SAMPLE SIZE / LOT

C1

Wire Bond Shear

WBS

30 bonds from a minimumof 5 devices

C2

Wire Bond Pull

WBP

C3

Solderability

SD

15

C4

Physical Dimensions

PD

10

C5

Solder Ball Shear

SBS

5 balls from a min. of 10devices

C6

Lead Integrity

LI

from each 10 leads of 5 parts

TEST GROUP D – DIE FABRICATION RELIABILITY TESTS

#

STRESS

ABV

SAMPLE SIZE / LOT

D1

Electromigration

EM

---

D2

Time Dependent Dielectric Breakdown

TDDB

---

D3

Hot Carrier Injection

HCI

---

D4

Negative Bias Temperature Instability

NBTI

---

D5

Stress Migration

SM

---

TEST GROUP E – ELECTRICAL VERIFICATION TESTS

#

STRESS

ABV

SAMPLE SIZE / LOT

E1

Pre- and Post-Stress Function/Parameter

TEST

All

E2

Electrostatic Discharge Human Body Model

HBM

See TestMethod

E3

Electrostatic Discharge Charged Device Model

CDM

See TestMethod

TEST GROUP E – ELECTRICAL VERIFICATION TESTS (CONTINUED)

#

STRESS

ABV

SAMPLE SIZE / LOT

E4

Latch-Up

LU

6

E5

Electrical Distributions

ED

30

E6

Fault Grading

FG

---

E7

Characterization

CHAR

---

E9

Electromagnetic Compatibility

EMC

1

E10

Short Circuit Characterization

SC

10

E11

Soft Error Rate

SER

3

E12

Lead (Pb) Free

LF

See Test Method

TEST GROUP F – DEFECT SCREENING TESTS

#

STRESS

ABV

SAMPLE SIZE / LOT

F1

Process Average Testing

PAT

---

F2

Statistical Bin/Yield Analysis

SBA

---

TEST GROUP G – CAVITY PACKAGE INTEGRITY TESTS

#

STRESS

ABV

SAMPLE SIZE / LOT

G1

Mechanical Shock

MS

15

G2

Variable Frequency Vibration

VFV

15

G3

Constant Acceleration

CA

15

G4

Gross/Fine Leak

GFL

15

G5

Package Drop

DROP

5

G6

Lid Torque

LT

5

G7

Die Shear

DS

5

G8

Internal Water Vapor

IWV

5